Copper GPU Water Cooling Block
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Product Details
By second generation three-layer structure design,increase water flow coverage area,make water flow more scientific,improve heat dissipation efficiency. Copper plate is integrated with high-precison CNC processing,with high-precision CNC processing,with large water flow coverage area,and the cavity is scientifically rigorous fluid analysis,without dead angle of water flow,thus providing effective heat dissipation for GPU/MOS/VRAM. 10MM thick copper plate design,material enough,surface electroplating treatment.Anti-oxidation,corrosion resistance,due to the use of thick copper plate,the sealing ring can be designed with a single layer,relative to the thin copper plate with multiple sealing ring structure,effectively reduce the risk of leakage. Copper plate adopts large area hollowing out to reduce weight,realize lightweight design,reduce cold head weight,protect PCB from deformation,The height of several positioning columns in the grooves is optimized to ensure that they fit the required heat dissipation components strctly and cover the GPU core,VRAM and power supply MOS. Please double check the graphics card detail model to ensure compatibility. If you are not very sure,please refer to the third picture in the description picture and compare whether the PCB in the picture is the same as that of your graphics card.Or Please feel free to contact us.